Heat Transfer Simulation in Mechatronic Devices Using Fourier Heat Conduction Analysis

Abstract

Thermal management has become a fundamental design challenge in mechatronic systems because tighter packaging and higher power levels push component densities beyond previous norms. If heat spreads unchecked, devices may operate sluggishly, circuits may grow brittle, and the risk of electrical arcing or burns rises sharply. To address these issues, the present study introduces a simulation platform grounded in Fourier’s heat-conduction law, aimed specifically at cylindrical assemblies common in motors or smart modules. Modelling begins with a layered scheme that discretises each shell according to geometry and material, then merges analytical solutions with finite-element analysis run in MATLAB and COMSOL. Engineers first specify part dimensions, next allocate thermal properties, followed by imposing temperature, convection, or insulation limits, and finally march forward or backward in time until steady or transient fields appear. Side-by-side tests against physical sensors confirm that the tool quantifies temperature fields with satisfactory fidelity. Take the copper winding: predicted and measured peak at about 300 °C differ by only 1 °C (297 °C observed). Surrounding interfaces including thermal paste stay within a reasonable band too, yielding an overall root-mean-square error of only 2.41 °C across the assembly. Such performance proves the framework reliable for locating thermal hotspots, estimating heat-loss rates, and guiding design changes like thicker insulation or alternative alloys before hardware is built. The new Fourier-based simulation approach offers a fast and physically realistic way to forecast and manage heating patterns in mechatronic assemblies. Because it runs quickly, the method can be embedded in real-time thermal sensors and adaptive controllers, positioning it for cutting-edge robotics, automotive platforms, and factory automation.