STRANSKY, Petra; BJÖRKMAN, Linus. Heat Transfer Simulation in Mechatronic Devices Using Fourier Heat Conduction Analysis. Association Journal of Interdisciplinary Technics in Engineering Mechanics, [S. l.], v. 3, n. 4, p. 38–50, 2025. Disponível em: https://ajitem.org/index.php/journal/article/view/EM34005. Acesso em: 29 apr. 2026.